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浙江大学学报(工学版)
浙江大学学报(工学版)
电信技术     
片上光电互连的多核系统仿真方法
于绩洋,刘鹏,华幸成,马骧,杨建义
浙江大学 信息与电子工程学院,浙江 杭州 310027
Simulation approach of hybrid optical electrical on chip interconnects for multicore systems
YU Ji yang, LIU Peng, HUA Xing cheng, MA Xiang, YANG Jian yi
College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou, 310027, China
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摘要：

为了攻克多核系统的光电互连网络模拟的仿真精度、支持多核系统的整体系统仿真、对多核光电互连结构和处理器微结构进行量化研究和评估,提出一种面向多核光电互连系统的仿真方案.对光电器件进行物理层精确建模,实现器件库与功能模型、时序模型和成本模型协同工作；采用周期同步机制,实现多核系统光电互连网络的周期级精确仿真；通过多线程扩展机制,支持16至256核多核系统的快速定量评估.结果表明,面向多核光电互连系统的跨层仿真方案可以分析256核情况下不同分簇大小的网络功耗、时延等性能,可探索光电互连网络体系结构的设计空间.
Abstract:

A simulation approach of optical electrical interconnects for multicore systems was proposed to address the accuracy of simulation for optical electrical on chip interconnects of multicore systems, to support  the system simulation, and to study and evaluate hybrid optical electrical on chip interconnects and microarchitectures.  The optical devices and electrical devices were accurately modeled, and the device library worked cooperatively with the functional model. timing model, and cost model. A cycle synchronization mechanism was employed to achieve cycle accurate simulation for optical electrical on chip interconnects. A multithreading mechanism was implemented to extend the simulation scale from 16 node to 256 node. The experimental results show that the proposed simulation approach can analyze the network performance of 256 node systems, in terms of network power consumption and latency. The cross layer simulation solution can explore the design space of optical electrical on chip networks architecture.
出版日期: 2015-11-01
:  TP 302  
基金资助:

华为技术有限公司资助项目（YB2012120072，YB2014100047）
通讯作者: 刘鹏，男，副教授.ORCID:0000 0001 9107 6673.     E-mail: liupeng@zju.edu.cn
作者简介: 于绩洋（1986- ），男，博士生，从事多核互连体系结构方向的研究.ORCID:0000 0001 8673 028X.E-mail：zju.isee.yjy@gmail.com
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于绩洋,刘鹏,华幸成,马骧,杨建义. 片上光电互连的多核系统仿真方法[J]. 浙江大学学报(工学版), 10.3785/j.issn.1008 973X.2015.11.025.

YU Ji yang, LIU Peng, HUA Xing cheng, MA Xiang, YANG Jian yi. Simulation approach of hybrid optical electrical on chip interconnects for multicore systems. JOURNAL OF ZHEJIANG UNIVERSITY (ENGINEERING SCIENCE), 10.3785/j.issn.1008 973X.2015.11.025.

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http://www.zjujournals.com/eng/CN/10.3785/j.issn.1008 973X.2015.11.025    或    http://www.zjujournals.com/eng/CN/Y2015/V49/I11/2214

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